Renesas Electronics brought out an open image signal processor bundle, meant to be integrated with its R-Car V3M and R-Car V3H system-on-a-chip devices for automotive smart camera applications. The offering includes Sony's IMX390 image sensor and the Automotive Camera Development Kit from MM Solutions.
Researchers at the Korea Advanced Institute of Science and Technology report development of a new, improved method for transferring nanowires to a flexible substrate. Using physical vapor deposition technology, the team was able to place nanowires on flexible substrates with a nanosacrificial layer and nanowires on a nanograting substrate.
Release 3 of the oneM2M standard for the internet of things addresses 3GPP interworking, providing greater support for cellular IoT connectivity. "The ultimate goal of oneM2M is to open up the IoT ecosystem and improve the business case for players looking to launch services," said Omar Elloumi of Nokia.
After the microcontroller market hit a rough patch in 2016, growth resumed last year and is expected to continue through 2022, largely thanks to the internet of things and increasing use of sensors, IC Insights says. The market research firm forecasts MCU sales will have a compound annual growth rate of 7.2% over five years, hitting almost $23.9 billion in 2022.
Six industry experts discuss chip aging and reliability issues during this era of sub-10-nanometer features in this roundtable interview, especially when it comes to automotive chips and other ICs that must work correctly for a decade or more. "Design teams somehow have to verify the quality after 10 or 15 years of operation," says Christoph Sohrmann of Fraunhofer EAS.
Google's data centers are seeing energy savings of 30% when the company follows recommendations made by its artificial intelligence control systems. Jim Gao of Google's DeepMind AI team says the AI system is "currently live in multiple Google data centers with plans to roll out further."
Hitachi came up with a silicon carbide-based trench-etched-double-diffused metal-oxide semiconductor device that is said to provide 50% energy savings compared with a depletion-mode MOS field-effect transistor. The TED-MOS device uses a fin-structured trench MOSFET based on a conventional DMOS-FET, providing smaller electric field strength and lower resistance in SiC power semiconductors.
Leopard Imaging, OmniVision and Texas Instruments collaborated on development of a high-definition automotive camera module reference design, qualified for the AEC-Q100 Grade 2 specification. The reference design incorporates OmniVision's OX01B40 image sensor with an image signal processor system-in-package, while adding TI's DS90UB933-Q1 or DS90UB935-Q1 serializer chips and the TPS65000-Q1 power management integrated circuit.
Nonvolatile dual in-line memory modules are gaining in industry acceptance through the use of magnetoresistive random-access memories in the place of DRAMs, which usually go into dual in-line memory modules, Bob Warren writes. MRAMs use less energy, and NVDIMMs can be used in software-defined data storage, he notes.
Jason Taylor, Facebook's vice president of infrastructure, says the company is hiring IC designers and has an application-specific integrated circuit project underway. The social media giant announced that five chip-related firms -- Intel, Marvell Technology Group, Cadence Design Systems, Qualcomm and Esperanto Technologies -- are embracing Glow, an open-source deep-learning compiler that Facebook supports.